Keynote Speakers



Prof. Yang Xiao, IET Fellow, IEEE Fellow
The University of Alabama, USA

Yang Xiao (Fellow, IEEE) is currently a Full Professor with the Department of Computer Science, The University of Alabama, Tuscaloosa, AL, USA. He had directed 20 doctoral dissertations and supervised 19 M.S. theses/projects. He has published over 300 Science Citation Index (SCI)-indexed journal papers (including over 60 IEEE/ACM TRANSACTIONS) and 300 Engineering Index (EI)-indexed refereed conference papers and book chapters related to these research areas. His current research interests include cyber–physical systems, the Internet of Things, security, wireless networks, smart grid, and telemedicine.

Prof. Xiao was a Voting Member of the IEEE 802.11 Working Group from 2001 to 2004, involving the IEEE 802.11 (Wi-Fi) standardization work. He is also an IET Fellow and an AAIA Fellow. He also serves as the Editor-in-Chief of Cyber-Physical Systems journal, International Journal of Sensor Networks (IJSNet), and International Journal of Security and Networks (IJSN). He has been serving as an Editorial Board Member or an Associate Editor for 20 international journals, including the IEEE TRANSACTIONS ON CYBERNETICS since 2020, IEEE TRANSACTIONS ON SYSTEMS, MAN, AND CYBERNETICS: SYSTEMS from 2014 to 2015, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY from 2007 to 2009, and IEEE COMMUNICATIONS SURVEYS AND TUTORIALS from 2007 to 2014.

Prof. Kan Wu,
Shanghai Jiao Tong University, China

Dr. Kan Wu is a professor in State Key Laboratory of Advanced Optical Communication Systems and Networks, Shanghai Jiao Tong University, China. Dr. Wu received his B.E. and M.S. degrees from Shanghai Jiao Tong University in 2006 and 2009, and Ph.D. degree from Nanyang Technological University in Singapore 2013. He was supported by NSFC Excellent Young Scholar in 2019. Dr. Wu’s research interests mainly focus on integrated photonics including high-speed pulse generation, beam steering and Lidar. Dr. Wu has published more than 50 papers on Light Science and Applications, Nature Communications, Physical Review X, and Optics Letters etc. including four ESI hot / highly cited papers and more than 2000 citations.

 

Assoc. Prof. Hongyan Fu,
Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, China

Hongyan Fu is currently an associate professor at Data Science and Information Technology Research Center, Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University. He received the B.S. degree in electronic and information engineering from Zhejiang University and the M.S. degree in electrical engineering with specialty in photonics from Royal Institute of Technology, Sweden, and the Ph.D. degree from the Department of Electrical Engineering from Hong Kong Polytechnic University. His research focuses on integrated photonics and its related applications in communications and sensing including silicon photonics, optical wireless communications, and 3D sensing. From 2005 to 2010, he was a research assistant and then research associate with Photonic Research Center, the Hong Kong Polytechnic University. From 2010 to April 2017, Dr. Fu was a founding member and leading the advanced optic communications research at Central Research Institute, Huawei. He was the project manager of All-Optical Networks (AON), which was evolved to a company-wide flagship research project that covers whole aspects of next generation optical communication technologies to guarantee Huawei’s leading position. He was also a representative for Huawei at several industry/academic standards/forums. He was an active contributor at IEEE 802.3 Ethernet and Optical Internetworking Forum (OIF) where he was an OIF Speaker from 2012 to 2013. Dr. Fu is member of IEEE and life member of OSA, SPIE. Since 2017, he is the advisor of OSA Student Chapter at TBSI, Tsinghua University. Since 2020, he is the advisor of IEEE Photonics Society Student Branch Chapter and SPIE Student Chapter at TBSI, Tsinghua University. Dr. Fu has authored/co-authored more than 150 journal or conference papers, 1 book chapter, over 50 granted/pending China /Europe/Japan/ US patents.